Aluminium Nitride
Wesgo supplies Aluminum Nitride formulations for parts and assemblies. Our formulations offer high thermal conductivity, high purity, high strength, and tailorable resistivity*. Thick film metallization and ABA brazing are available for special applications.
| AN999 | AN985 | AN960CD | |
|---|---|---|---|
| Applications | Heater Wafer Handling | Heat Sink Substrate | Static Charge Dissipation |
| Composition (AlN Wt%) | >99.9% | >98.5% | >96% |
| Density (g/cc) | 3.23 | 3.3 | 3.3 |
| Flexural Strength (MPa) | 300 | 285 | 275 |
| Young's Modulus (MSI) | 39 | 45 | 40 |
| Shear Modulus (MSI) | 20 | 19 | 19 |
| Poisson's Ratio | 0.22 | 0.21 | 0.21 |
| Grain Size (Microns) | 7 | 7 | 7 |
| Thermal Conductivity (W/mK) | 150 | 175 | 130 |
| Coeff. of Thermal Expansion (10-6/C) RT-400ºC | 3.7 | 3.6 | 5.1 |
| Volume Resistivity at RT (ohm cm) | >1013 | >1013 | ~1010 |
| Dielectric Constant at 100 KHz | 8.9 | 8.8 | 8.7 |
* Charge dissipative material is available in a variety of resistivity values and formulations. Please call for details.