Materials:
Aluminum Nitride
Wesgo supplies Aluminum Nitride formulations for parts and assemblies. Our formulations offer high thermal conductivity, high purity, high strength, and tailorable
resistivity*. Thick film metallization and ABA brazing are available for special applications.
| |
AN999 |
AN985 |
AN960CD |
|
Applications |
Heater Wafer Handling |
Heat Sink Substrate |
Static Charge Dissipation |
Composition
(AlN Wt%) |
>99.9% |
>98.5% |
>96% |
Density
(g/cc) |
3.23 |
3.3 |
3.3 |
Flexural Strength
(MPa) |
300 |
285 |
275 |
Young's Modulus
(MSI) |
39 |
45 |
40 |
Shear Modulus
(MSI) |
20 |
19 |
19 |
Poisson's Ratio
|
0.22 |
0.21 |
0.21 |
Grain Size
(Microns) |
7 |
7 |
7 |
Thermal Conductivity
(W/mK) |
150 |
175 |
130 |
Coeff. of Thermal Expansion
(10-6/C) RT-400ºC |
3.7 |
3.6 |
5.1 |
Volume Resistivity at RT
(ohm cm) |
>1013 |
>1013 |
~1010 |
Dielectric Constant
at 100 KHz |
8.9 |
8.8 |
8.7 |
* Charge dissipative material is available in a variety of resistivity values and formulations. Please call for details.
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Wesgo® Ceramics
2425 Whipple Road, Hayward, CA 94544 USA
Phone (510) 491-1100 • Fax (510) 491-1175
A Division of Morgan
Advanced Ceramics
Morgan
Technical Ceramics is a Global Business
Unit of the Morgan
Crucible Company plc.
It comprises Morgan
Advanced Ceramics and Morgan
Electro Ceramics
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